In today’s high-tech world, the complexity of semiconductor devices continues to grow. From 5G chips to artificial intelligence processors, the demand for high-performance and miniaturized electronics drives innovations in packaging technologies. Amid this evolution, semiconductor X-ray inspection has become a critical tool for ensuring the quality, reliability, and performance of microelectronic devices. This article explores the key role that X-ray inspection plays in the future of advanced packaging and how it continues to transform modern electronics manufacturing.